Two-dimensional semiconductor material family has a "small meat" tin oxide

Utah University engineers recently discovered a new two-dimensional semiconductor material, tin oxide (SnO), a single-layer material that is one atom thick and can be used to make transistors that are integral to electronic devices. The researchers said the latest research will help scientists develop computers that run faster and consume less energy, and mobile devices, including smartphones.

Tin Oxide The "small meat" team led by Ayuthotas Tavari, associate professor of materials science and engineering at the University of Utah, found that it consists of tin and oxygen. At present, transistors and other components in electronic devices are made of three-dimensional materials such as silicon, and a glass substrate contains a plurality of layers of three-dimensional material. But the drawback of 3D materials is that electrons bounce around in all directions in the layer. Tiwari explains that the advantage of a two-dimensional material is that it consists of a sandwich of only one or two atoms thick, and the electrons move only in the sandwich so they move faster.

Two-dimensional semiconductor materials began to be a research hot spot five years ago. Although researchers have discovered a variety of two-dimensional materials such as graphene, molybdenum disulfide and boron ink, these materials allow only negatively charged electron (N-type) motions , While manufacturing electronic devices requires both electrons and positively charged "hole" (p-type) moving semiconductor materials. The newly discovered tin oxide is the first stable p-type two-dimensional semiconductor material ever.

Tin oxide materials help scientists develop smaller and faster transistors. Computer processors include billions of transistors. The more transistors integrated on a single chip, the more powerful the processor, and ultimately Scientists can either produce computers and smartphones 100x faster than existing devices. In addition, in such materials, the electrons are less likely to bounce over the layer rather than bouncing back and forth inside the three-dimensional material, resulting in less friction, making the processor less prone to overheating as conventional computer chips do, and their operational needs Less energy, which is a huge blessing for mobile devices that must rely on batteries, especially medical devices, including electronic implants.

Tibaly said the model equipment is expected to come out in two or three years. Related research papers published in the 15th edition of "Advanced Electrical Materials" magazine online version.

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Tin is an old friend of mankind, thousands of years ago people were mining tin, so smelting bronze. This familiar metal, which was originally used as a solder paste and was a supporting character on the circuit board, now finds its potential. Tin oxide a play, can not find post graphene and boron finally have a partner, a single atomic thickness of the integrated circuit ready to wait for three months without heating mobile phone or will be standard.

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